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CETC ELECTRONICS EQUIPMENT GROUP CO., LTD.     京ICP备15059159号     京公网安备11010602005565号 | Powered by www.300.cn

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Dicing Saw

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The equipment is suitable for wafer, BGA, QFN and PCB materials. The maximum size of the workpiece is 300mm and the maximum thickness is 2mm. The main machine adopts the structure of the bridge type precision worktable, the double shaft is installed to the right, and the cutting efficiency is high. The main shaft is an air static DC electric spindle. Two fluid efficient cleaning. It has the function of non-contact measuring and cutting, and the operation reliability of the equipment is high. It is equipped with log function, which is easy to query and maintain in the production process.

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